Our background in electronics overmoulding goes back many years, providing a wealth of experience in overmoulding Cable Assemblies to provide connector sealing and strain relief. Today, in addition to overmoulding Cable Assemblies, we provide the latest and most cost effective moulding process for the protection and encapsulation of Printed Circuit Board Assemblies ( PCB’s ). [...]
We can usually quote if you can provide a sample or a drawing or picture of the assembly you require overmoulding, plus its dimensions. We need to know what environment the overmoulded product will be subject to in order to determine its properties required ( e.g. heat or UV light resistance etc. ). We also [...]
Yes, our toolmaking associates have been crafting precision low pressure moulding tools in aluminium that have been used world-wide since the process evolved during the mid 90’s. They have the skills to create a precision mould tool by importing 3D CAD model data using the STEP ( ISO 10303) standard to network directly with their [...]
Yes, we use suppliers that only ship RoHS and WEEE compliant materials.
Circa 110mm x 90mm
Amber or black are the standard colour choices available. Some custom colours are available. Please contact us for details.
Yes, logos, product ID’s and text can be engraved on mould tools either in recessed or protruding format.
For most applications we recommend aluminium mould tools, which are quicker and less costly to produce than steel. They offer excellent performance for volumes typically from 100 – 500,000, for simple to complex moulding applications that need production quickly on a tight budget. Where there are no cost constraints and volumes are in the millions, [...]
We use Thermoplasitc polymers ( Polyamide and Polyolefin ) i.e. polymers that become pliable or mouldable above a specific temperature and return to a solid state on cooling. They also possess excellent adhesive, moisture and UV light resistance properties, are quick to cure and are the preferred materials for low pressure overmoulding. The performance of [...]
Why do you recommend Low Pressure Overmoulding over traditional potting or other encapsulation processes?
LPO is a 3 step process ( insert assembly > overmould > test ) versus an 8 step process for potting. This removal of process steps reduces manufacturing time, overall labour and material costs and improves throughput, resulting in increased ROI. There is zero waste, scrap is often recyclable and the process is environmentally friendly, [...]