Electronics Manufacturing FAQs

1. Where should I manufacture my electronics?

Select a facility with expertise in your industry, robust quality certifications and geographic advantages for your supply chain.

Your choice should depend on factors like proximity to your R&D centre, lead times for components, labour costs and local compliance requirements. Manufacturing in the UK or Europe with EC Electronics offers low‑risk logistics and streamlined customs for EU markets. Plus, our multi‑site footprint means capacity can flex to match demand without sacrificing consistency or quality.

2. How do I choose sustainable materials for electronics? 

If sustainability is key (and it should be!), look for RoHS‑compliant components, halogen‑free laminates and eco‑friendly conformal coatings.

Sustainable electronics manufacturing involves materials that minimise toxic substances and facilitate end‑of‑life recycling. Examples include lead‑free solder alloys (e.g. SAC305), halogen‑free FR‑4 and water‑based conformal coatings.

You should also make sure your electronics manufacturer has an ISO 14001 certification to demonstrate they’re committed to environmental management, waste reduction and continual eco‑improvement.

3. What are the different types of printed circuit boards?

Common PCB types include single‑sided, double‑sided and multi‑layer boards:

• Single‑sided PCBs: one copper layer — used in low‑density applications.
• Double‑sided PCBs: copper on both sides — enables more complex routing.
• Multi‑layer PCBs: multiple internal layers — ideal for high‑density and high‑speed designs in industries like telecommunications, automotive and medical.

Speciality boards include rigid‑flex, metal‑core for heat dissipation and high‑frequency materials for radar, RF and microwave applications.

4. How are printed circuit boards manufactured?

PCBs are built by layering copper, laminates and substrates, then etched and drilled according to your design.

The PCB assembly process includes: 

1. Design and CAM preparation: Gerber files generate tooling data.
2. Material lamination: resin‑impregnated fibreglass is heat‑press bonded.
3. Image transfer and etching: UV‑resist patterns protect copper that remains; unwanted copper is chemically removed.
4. Drilling and plating: precision drills create vias; electrolytic plating deposits copper through the holes.
5. Solder mask and silkscreen: A protective mask is applied; component IDs are printed.
6. Profiling and routing: boards are cut to shape (V‑score, routing).
7. Final inspection and testing: AOI, electrical tests and mechanical checks ensure accuracy.

5. How can I solder a printed circuit board?

Use reflow soldering for surface-mount device parts and wave or selective soldering for through‑hole components.

• Reflow soldering: paste solder is applied via stencil, and components are placed by pick‑and‑place before the PCB is passed through a controlled reflow oven.
• Wave soldering: PCBs pass over a wave of molten solder (this method is ideal for wave‑tabled through‑hole boards).
• Selective soldering: Robotic solder nozzles target specific points — perfect for mixed‑technology assemblies.

Process control, proper preheat profiles and solder alloy selection (e.g. SAC305) are vital to avoid defects like tombstoning or solder bridges.

6. What is surface‑mount technology (SMT)?

Surface-mount technology (SMT) mounts components directly onto the PCB surface rather than inserting leads through holes.

SMT is the dominant assembly method for modern electronics, enabling compact, lightweight and high‑density boards. Components range from tiny 0201 passives to large QFNs and BGAs. Automated pick‑and‑place machines achieve high accuracy and speed, while stencil‑printed solder paste and controlled reflow ovens ensure consistent quality.

Our surface-mount technology lines are capable of placing BGA parts as well as fine-pitch devices. The equipment can be programmed to place a full array of components. We also deploy through-hole technology for assemblies in many critical applications such as transformers, heatsinks, RF shields and connectors.

7. How should I dispose of printed circuit boards? 

You should recycle printed circuit boards through certified e‑waste processors that recover metals and properly handle hazardous materials.

PCBs contain valuable metals (copper, gold, silver) as well as hazardous substances like lead. Under WEEE regulations (EU) and UK e‑waste directives, OEMs must partner with licensed recyclers who employ processes like mechanical shredding, chemical leaching and smelting to recover resources while minimising environmental impact. As a business, EC Electronics is legally bound to comply with WEEE.

8. What are best practices for printed circuit board recycling?

Segregate e‑waste, use certified recyclers and follow your region’s e‑waste regulations.

1. Component de‑population: remove batteries and capacitors (these are hazardous if shredded).
2. Shredding and separation: mechanical processes separate metals, plastics and ceramics.
3. Smelting and refining: high‑temperature processes recover precious metals.
4. Compliance documentation: maintain audit trails for WEEE/ROHS to demonstrate legal adherence and environmental responsibility.

9. What is conformal coating? 

Conformal coating is a thin polymer layer applied to PCBs to protect against moisture, dust and chemicals.

These coatings — made of acrylic, silicone, urethane and parylene — shield sensitive circuitry in harsh environments, such as automotive engine bays, marine electronics and outdoor IoT sensors. They extend your product’s life and reliability and can be applied via spray, dip or selective robotic dispensers.

10. What does a conformal coating do? 

Conformal coating creates a protective barrier over circuitry to prevent contamination and corrosion. By sealing gaps around components and traces, conformal coatings guard against humidity, salt spray and airborne particulates. They also offer mild vibration dampening, which is beneficial if you’re creating products for industrial automation, transportation electronics or similar.

11. Which is the best conformal coating for PCBs?

The choice depends on your operating environment. Acrylics are ideal for general use, whereas silicones are more suited to high temperatures. Parylene offers an ultra‑thin, high‑purity conformal coating for PCBs.

• Acrylics: cost‑effective, easy rework, good dielectric properties.
• Silicones: excellent thermal stability, UV resistance, flexible.
• Urethanes: strong chemical resistance, harder film.
• Epoxies: high mechanical strength, excellent chemical and moisture resistance, durable but more challenging to rework.
• Parylene: vapour‑deposited for pin‑hole free, very thin, suitable for medical applications.

We can advise you on the most suitable conformal coating type for your PCBs.

12. What are the different conformal coating types?

There are five conformal coating types: acrylic, silicone, urethane, epoxy and parylene.

Each type balances properties like hardness, flexibility, dielectric strength, chemical resistance and ease of repair. For instance, epoxy coatings are extremely durable but hard to remove, whereas acrylics are easily stripped for rework.

Our skilled engineering team will be able to advise you on the best conformal coating type for your product and application.

13. Which materials are used for conformal coatings?

Polymer chemistries — such as acrylic resins, silicone oligomers, polyurethane, epoxy and parylene vapour — are used for conformal coatings.

• Solvent‑based vs UV‑cure: UV‑cure coatings offer fast cure times but require UV‑transparent zones.
• Solids content and viscosity determine the film thickness and application method.

14. How thick should a conformal coating be? 

IPC‑CC‑830 guidelines recommend 25–50 µm dry film thickness for most applications, although thicker films up to 100 µm may be used for high‑corrosion environments. Controlled thickness ensures balanced protection without interfering with connectors or mating surfaces.

15. What’s the difference between conformal coating and potting?

Coating is a thin film on the PCB surface, whereas potting/encapsulation encloses the entire board in a solid block.

Conformal coating is lightweight, reworkable and adds minimal mass. Potting offers superior mechanical support, vibration damping and moisture ingress protection — making it ideal for underwater or extreme‑shock environments. However, it’s important to note that potting is irreversible and adds bulk.

Our skilled engineering team can help you choose the best option for your product and application.

16. How long does conformal coating take to dry?

Conformal coating is typically dry to the touch in minutes, although a full cure can take 24 to 48 hours. UV‑cure varieties set in seconds under proper lamps.

Drying time depends on coating chemistry, film thickness, ambient temperature and humidity. Using controlled ovens or UV cure stations accelerates throughput in production environments.

17. What’s the best method to apply conformal coating?

Spray for prototypes, dip for uniform coverage or robotic selective for high‑volume precision.

• Manual spray: flexible and low‑cost, but operator‑dependent.
• Dip coating: complete coverage, but can flood connectors.
• Selective robotic: automated, accurate dispensing to optimise material usage and repeatability in mass production.

18. How can I remove conformal coating from a circuit board? 

To remove conformal coating from a printed circuit board, use designated chemical strippers or plasma processes (mechanical removal risks damaging the board).

Solvent‑based strippers soften the coating, whereas timed immersion dissolves the layer without harming solder or FR‑4. For parylene, plasma etching or mechanical abrasion under microscope control may be required.

19. Is conformal coating conductive?

No — standard coatings are dielectric. Conformal coatings are formulated to have high dielectric strength (often >20 kV/mm), preventing unintended conductive paths. Conductive coatings exist for EMI shielding but are a different category, often containing silver or carbon fillers.

20. Is conformal coating waterproof?

Coatings provide moisture resistance but not full waterproofing like potting. Coatings block water vapour and droplets, achieving IP ratings up to IP67 when combined with proper enclosure sealing. For IP68 immersion or deep‑sea use, potting or specialised overmoulding solutions may be required.

21. What does ingress protection (IP) mean? 

Ingress protection (IP) is a rating system that defines resistance to dust and water.

IP codes (e.g. IP65, IP67) consist of two digits: the first (0–6) for solids ingress protection, the second (0–9K) for liquids. This standard helps you specify your enclosure requirements for outdoor, marine or industrial environments.

22. How are ingress protection ratings explained?

The first digit rates dust protection (0 = none, 6 = dust‑tight); the second digit rates water protection (0 = none, 8 = immersion). For example:

• IP54: protection against limited dust ingress and water spray.
• IP67: Dust‑tight and immersion up to 1 m for 30 minutes.

Higher ratings (IP69K) cover high‑pressure washdowns and are essential for many automotive and marine applications. It’s important to understand ingress protection ratings to specify your enclosure requirements. We can help with this if you’re not sure what level of protection is right for your product or application.

23. What is ATEX certification?

ATEX certification is a European directive for equipment used in explosive atmospheres with flammable gases or dust. ATEX ensures products meet stringent safety requirements in high-risk environments like oil and gas sites.

EC Electronics is officially certified to EN ISO/IEC 80079-34:2018 standards in line with IECEx and ATEX Directive 2014/34/EU, ensuring all electronic equipment we manufacture for potentially explosive environments is subject to rigorous testing.

24. What does ISO 9001 mean?

ISO 9001 certification is a global standard for quality management systems (QMS). ISO 9001:2015 outlines requirements for consistent product quality, customer satisfaction and continuous improvement. As a leading electronics manufacturer in the UK and Europe, EC Electronics is ISO 9001 certified, ensuring rigorous process controls, traceability and corrective action procedures.

25. What does ISO 14001 mean? 

ISO 14001 certification is a standard for environmental management systems (EMS). ISO 14001:2015 defines best practices for legal compliance, sustainable operations and reducing environmental impact. Our ISO 14001 certification demonstrates our commitment to eco‑friendly electronic manufacturing services, including waste reduction, energy efficiency and responsible end‑of‑life product management.

26. Do you use automatic optical inspection (AOI)?

Yes — every PCB assembly we manufacture undergoes automatic optical inspection (AOI) to catch solder and placement defects before moving onto electrical testing.

Our AOI systems scan each board after reflow (and again after wave/selective soldering if needed) using high-resolution cameras and multi‑angle lighting. The software compares actual component positions, orientations, solder‑joint quality and presence/absence against the golden reference image from your CAD data. Any anomalies — such as tombstoned resistors, lifted leads, insufficient solder fillets or missing parts — are flagged for review. Our operators then verify and correct defects immediately, ensuring very high first‑pass yields and reducing downstream rework time.

27. Do you use in‑circuit testing (ICT) and automated test equipment (ATE)?

Yes — we use both ICT and ATE to verify electrical functionality at different stages of production.

• In‑circuit testing (ICT) is carried out once the bare‑board assembly is complete. ICT uses a bed‑of‑nails test fixture to make contact with individual nets, checking for opens, shorts, resistor values and correct component orientation. It’s ideal for finding manufacturing defects — such as cold joints, missing components or wrong values — before moving into functional testing.
• Automated test equipment (ATE) is used after ICT and functional test programming. Our ATE systems exercise your board under simulated operating conditions — applying power, I²C/SPI traffic, analogue stimuli and digital I/O patterns to verify full device behaviour. ATE provides a final, end‑of‑line check that your assembled product meets all electrical performance criteria before shipment.

28. Which types of machines do you use for PCB and cable assembly?

Over the years, we have invested heavily in equipping our manufacturing sites with state-of-the-art convection reflow and wave soldering equipment for PCB assembly. This ensures controlled soldering of PCB components following automatic or hand placement. Our four automatic high-speed YAMAHA SMD pick-and-place lines are configured with large component sequencers, advanced solder paste printers and convection reflow solder.

Our new Axxon‑Mycronic MYC50 conformal coating system is now fully operational, featuring dual heads (fine‑line and spray) and an automatic loader/unloader that holds up to 50 panels per magazine, with two magazines running concurrently. With an average of 25 circuits per panel, the MYC50 can process around 2,500 circuits end‑to‑end without human intervention. This delivers superior precision — thanks to built‑in UV backlighting for in‑process inspection — while eliminating masking steps, reducing coating material costs (no more aerosol cans) and minimising waste. 

Our fully automatic Komax 255 and wire processing machines incorporate digital crimp height and crimp force analysis at every termination, ensuring high-quality cable assemblies every time. These advanced machines are supported by a wide range of modern semi-automatic wire preparation, crimping and marking equipment — all of which are used for lower volume, more bespoke cable assemblies.

29. What is product realisation?

Product realisation is the complete journey from concept through design, prototyping, manufacturing and delivery. It is a structured process that aligns engineering, manufacturing, quality and supply chain to ensure your product meets functional, regulatory and commercial goals on time and on budget.

30. What does the product realisation process involve?

Product realisation stages include requirements capture, design, prototyping, testing, validation and production launch:

1. Concept and feasibility: market analysis, technical viability.
2. Design and DFM review: schematic capture, PCB layout, manufacturability checks.
3. Prototype build and test: proof‑of‑concept assemblies, functional validation, EMC testing.
4. Pilot production: small batch runs to qualify processes, yields and documentation.
5. Full‑scale manufacture: ongoing production with continuous improvement and support.

Choosing your electronics manufacturer

Finding the right partner for electronics manufacturing can speed up your product’s time to market, control costs and improve quality. As one of the leading electronic manufacturers in the UK and Europe, EC Electronics is ready to support your next OEM project with our customer‑friendly approach and deep technical expertise.

Learn more about our electronic manufacturing services or contact us today to speak to our skilled NPI and engineering team about your project requirements.